Highcon: Introducing the Beam 2C and Advanced Packaging Innovations
Interview with Edi Perets, Solutions Architect & CSM at SuperCorrExpo 2024.
Interview with Edi Perets, Solutions Architect & CSM at SuperCorrExpo 2024.
“We are excited to lead the market in digital die cutting for corrugated packaging and display, driving growth, and boosting ...
“We are excited to introduce the Highcon die-cutting system to our facility. This will enable us to expand our range ...
”We are impressed with how fast we have started production ramp up. Within 3 weeks from systems delivery, we have ...
“I am excited about Menasha’s focus on modernizing their network, and their intent to build a more strategic relationship with ...
“Highcon’s unique solutions can be a very valuable building block in the digitalization and enhanced operational efficiency of the corrugated ...
“HighConnect gives us all the data we need to evaluate our investment in our new equipment,” says Jean-Paul Wheater, Continual ...
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